FIT

Description du produit

Ideal for composite bonding, the FIT range product line offers low temperature curing reactions and minimal shrinkage, which protects composite resins from bond line readthrough and stresses. With high thixotropic properties for high gap filling, FIT structural adhesives reduce dispensing time and adhesive waste, enhancing operational efficiencies while lowering overall costs.

Caractéristiques du produit

• Flexibility
• Thixotropy