Description

CSP Underfills: Reworkable and non-reworkable formulations that lower stress, improve reliability, offer room temperature flowability, and effectively fill bottom-side components spaces with low bump heights. Glob Top & Encapsulants: Superior protection for electronic components attached to circuit boards. Chip-on-board components are shielded from environmental stresses, contamination, and mechanical vibration. Available in silicones, epoxies and hybrid chemistries.

Features

  • Better reliability and mechanical performance, strong adhesion to various substrates
  • Easy and tunable processing across a comprehensive range of application

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