LOCTITE ECCOBOND

Description

CSP Underfills: Reworkable and non-reworkable formulations that lower stress, improve reliability, offer room temperature flowability, and effectively fill bottom-side components spaces with low bump heights. Glob Top & Encapsulants: Superior protection for electronic components attached to circuit boards. Chip-on-board components are shielded from environmental stresses, contamination, and mechanical vibration. Available in silicones, epoxies and hybrid chemistries.

Features

• Better reliability and mechanical performance, strong adhesion to various substrates
• Easy and tunable processing across a comprehensive range of application